Computex is due to take place in Taipei on June 4-7. Computex is a more PC-centric trade show, and we see several PC peripheral IC design companies that could benefit from the new Intel platform, Ultrabook, and touch-devices:
Expectations are running high from the laggards in the race Intel & Microsoft – Intel is expected to feature Haswell ultrabooks (ranging from the value segment to innovative high-end segment), and Microsoft should emphasize Windows touch experiences across different devices. Thanks to Microsoft’s full support of small screen touch, we believe touch module adoption will be extended to the 11.6” and below segment. Expect Tablet PC to be priced from US$149+, and we are going to see touch NetBook pricing to start from US$399 and ultrabook pricing to start from US$499.
Asustek has been hinting that it will introduce a “hero tablet PC product” at Computex that will enable it to surpass Samsung in terms of the combined shipment market share of NB + tablet PC.
Asustek Tranformer Book
Asustek’s primary goals this year is to make the Transformer Book (a detachable touch NB) a mainstream product (vs. premium pricing currently at ~US$1,280 for 13.3”).
Asustek Clam Shell Devices
Asustek, to introduce clam shell touch NBs will aggressive pricing – i.e., 11.6” touch NB price to start from US$399 – and some will also introduce Win 8 tablet PCs with prices to start from ~US$300+, in response to Microsoft’s Win 8 licensing fee price cuts for small-screen-size touch-enabled devices.
Processors for Low Cost Tablets
Expect both x86- and ARM-based tablets to be demonstrated at Computex. Allwinners and Rockchip are market share leaders in white-brand tablets, but we think MediaTek has a stronger position in brand tablets than Acer and Lenovo, given its stronger product offering.
Innovations in Touch Display
We expect some PC OEMs to demonstrate higher-resolution NB/tablets, which would require more units of LCD driver IC and higher-end timing controller. Also expect OGS (one-glass solution) with or without direct bonding, GFF (glass/film/film), G1F (glass/film), and standardized touch module design. This should resolve the supply tightness of major OGS touch design (with direct bonding) in NB models in H1-2013.